WECC-2315 Design Guide for high Density Interconnect(HDI) and Microvias
WECC-4104 Specification for High Density Interconnect(HDI) and Microvia Materials
WECC-6202 Performance Guide Manual for Single -and Double -Sided Flexible Printed Wiring Boards
WECC-6801 Terms and Definitions,Test Methods,and Design Examples for Build -Up/High Density Interconnect (HDI) Printed Wiring Boards
UL796 Standard for Safety Printed-Wiring Boards （2003.02）第八版 印制线路板安全标准
QB/T 3819-1999 轻工产品金属镀层化学处理层的厚度测试方法 β射线反向散射法
JB/T 5466-91 高阻计
JB/T 10014-1999 数显电感测微仪
SJ/T 9545-93 有金属化孔的单、双面印制板的质量分等标准
SJ/T 10188-91 印制板安装用元器件的设计和使用指南
SJ/T 10309-92 印制板用阻焊剂
SJ/T 10329-92 印制板返修、修理和修改
SJ/T 10389-93 印制板的包装、运输和保管
SJ/T 10565-94 印制板组装件装联技术要求
SJ/T 10666-1995 表面组装组件的焊点质量评定
SJ/T 10668-2002 表面组装技术术语
SJ/T 10669-1995 表面组装元器件可焊性试验
SJ/T 10670-1995 表面组装工艺通用技术要求
SJ/T 10715-1996 无金属化孔单双面印制板能力详细规范
SJ/T 10716-1996 有金属化孔单双面印制板能力详细规范 
SJ/T 11282-2003 印制板用“E”玻璃纤维纸规范
SJ/T 11283-2003 印制板用处理“E”玻璃纤维布规范
SJ 20439-94 印制底板组装件设计要求
SJ 20532-95 印制底板组装件通用规范 
SJ 20604-96 挠性和刚挠印制板总规范
SJ 20632-97 印制板组装件总规范
SJ 20810-2002 印制板尺寸与公差
SJ 20828-2002 合格鉴定用测试图形和布设总图
SJ 20846-2002 电镀用氰化亚金钾规范
SJ 20857-2002 电阻箔复合材料规范
SJ 20896-2003 印制电路板组件装焊后的洁净度检测及分级
SJ 52142/2-2003 覆铜箔聚苯醚玻纤布层压板详细规范
GJB/Z 51.1-93 军用滤波器和网络系列型谱 电磁/射频干扰滤波器
GJB 1651-93 印制电路用覆金属箔层压板试验方法
GJB 2142-94 印制线路板用覆金属箔层压板总规范
GJB 2142/1-95 耐热阻燃型覆铜箔环氧玻璃布层压板详细规范
GJB 2830-97 挠性和刚挠印制板设计要求
GJB 362A-96 刚性印制板总规范
GJB 4057-2000 军用电子设备印制电路板设计要求
GJB 4896-2003 军用电子设备印制电路板验收判据 
IEC 674-2 Commission Electrotechnique Internationale International Electrotechnical Commission
IEC 60194 Printed board design, manufacture and assembly-Terms and definitions
IEC 60326-2 Printed boards Part 2: Test methods
IEC 61189-2 Test methods for electrical materials, interconnection structures and assemblies- Part 2: Test methods for materials for interconnection structures
IEC 61189-3 Test methods for electrical materials, interconnection structures and assemblies- Part 3: Test methods for interconnection structures (Printed boards)
IEC 61249-5-4 Materials for interconnection structures- Part 5: Sectional specification set for conductive foils and films with or without coatings- Section 4: Conductive inks 
IEC 61249-8-8 Materials for interconnection structures- Part 8: Sectional specification set for non-conductive films and coatings- Section 8: Temporary polymer coatings
IEC 62326-1 Printed boards- Part 1: Generic specification
IEC 62326-1 Printed boards- Part 1: Generic specification
IEC 62326-4 (1996-12 ) Printed boards-Part 4: Rigid multilayer printed boards with interlayer connections-Sectional specification 
IEC 62326-4-1 (1996-12 ) Printed boards-Part 4: Rigid multilayer printed boards with interlayer connections-Section specification-Section 1: Capability Detail Specification-Performance levels A,B and C
MIL-PRF-31032 Printed Circuit Board/Printed Wiring Board,General Specification For
MIL-PRF-31032/1A Printed Wiring Board, Rigid ,Multilayered 
MIL-PRF-31032/2 Printed wiring Board, Rigid ,Single and bouble layer.Woven E-Glass Reinforced Thermosetting Resin Base Material, With or Without Plated Holes ,For Soldered Part Mounting
MIL-PRF-55110F PRINTED WIRING BOAD ,RIGID GENGRAL SPECIPICATION FOR

更多PCB标准信息，请访问http://www.cpca.org.cn/partition/partition_7/partition_7.asp。