JIS B 0651-1996 Surface texture - Instruments for the assessment of surface texture - Profile method
JIS C 2110-1994 固体电气绝缘材料的绝缘耐力的试验方法
JIS C 2318-1997 Polyethylene terephthalate (PET) films for electrical purposes
JIS C 5010-1994 General rules for printed wiring boards 印制线路板通则
JIS C 5012-1993 Test methods for printed wring boards 印制线路板测试方法
JIS C 5013-1996 Single and double sided printed wiring boards 单双面印制线路板
JIS C 5014-1994 Multilayer printed wiring boards 多层印制线路板
JIS C 5016-1994 Test methods for flexible printed wring boards 挠性印制线路板测试方法
JIS C 5017-1994 Flexible printed wiring boards-Single-sided, Double-sided 单双面挠性印制线路板
JIS C 5603-1993 Terms and definitions for printed circuits 印制电路术语及定义
JIS K 5902-1969 日本工业规格
JIS C 6471-1995 Test methods of copper-clad laminates for flexible printed wring boards 挠性印制线路板用覆铜箔层压板测试方法
JIS C 6472-1995 Copper-clad laminates for flexible printed wiring boards (Polyester film, Polyimide film) 挠性印制线路板用覆铜箔层压板（聚酯薄膜、聚酰亚胺）
JIS C 6480-1994 General rules of copper-clad laminates for printed wiring boards 印制线路板用覆铜箔层压板通则
JIS C 6481-1996 Test methods of copper-clad laminates for printed wring boards 印制线路板用覆铜箔层压板测试方法
JIS C 6482-1997 Copper-clad laminates for printed wiring boards--Paper base, epoxy resin 印制线路板用覆铜箔层压板--环氧树脂纸基材
JIS C 6483-1997 Copper-clad laminates for printed wiring boards--Synthetic fiber fabric base, epoxy resin 印制线路板用覆铜箔层压板--环氧树脂合成纤维布基材
JIS C 6484-1997 Copper-clad laminates for printed wiring boards--Glass fabric base, epoxy resin 印制线路板用覆铜箔层压板--环氧树脂玻璃布基材
JIS C 6485-1997 Copper-clad laminates for printed wiring boards--Paper base, phenolic resin 印制线路板用覆铜箔层压板--酚醛树脂纸基材
JIS C 6486-1996 Thin copper-clad laminates for multilayer printed wiring boards--Glass fabric base, epoxy resin 多层印制线路板用覆薄铜层压板--环氧树脂玻璃布基材
JIS C 6488-1999 Base materials for printed circuits--Epoxide cellulose paper core, epoxide glass colth surfaces copper-clad laminated sheet of defined flammability(vertical burning test)
JIS C 6489-1994 Base materials for printed circuits--Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)
JIS C 6489-1999 Base materials for printed circuits--Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)
JIS C 6490-1998 Base materials for printed circuits--Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
JIS C 6492-1998 Base materials for printed circuits--Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
JIS C 6493-1999 Base materials for printed circuits--Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards JIS C 6494-1999 Base materials for printed circuits--Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
JIS C 6515-1998(IEC 61249-5-1-1995) Copper foil for printed wiring boards 印制线路板用铜箔 （英）（日）
JIS C 6520-1993 General rules of prepreg for multilayer printed wiring boards 多层印制板用半固化片通用规则
JIS C 6521-1996 Test methods of prepreg for multilayer printed wiring boards 多层印制线路板用半固化片测试方法
JIS C 6522-1996 Prepreg for multilayer printed wiring boards-Epoxy resin-impregnated glass cloth 多层印制线路板用半固化片--浸环氧树脂玻璃布
JIS C 6523-1995 Prepreg for multilayer printed wiring boards-Modified or unmodified polyimide resin-impregnated glass cloth 多层印制线路板用半固化片--预浸改良或未改良的聚酰亚胺树脂的玻璃布
JIS C 6524-1995 Prepreg for multilayer printed wiring boards-Bismaleimide/Triazine/Epoxide resin-impregnated glass cloth 多层印制线路板用半固化片
JIS B 7507-1993 Vernier,dial and digital callipers
JIS B 7516-1987 Metal rules
JIS B 7536-1982 Electrical Comparators
JIS P 8115-2001 纸及び板纸-耐折强さ试验方法－MIT 试验机法

更多PCB标准信息，请访问http://www.cpca.org.cn/partition/partition_7/partition_7.asp。