SIP :Single-In-Line Package DIP :Dual In-line Package 双列直插式封装 CDIP:Ceramic Dual-In-line Package 陶瓷双列直插式封装 PDIP:Plastic Dual-In-line Package 塑料双列直插式封装 SDIP :Shrink Dual-In-Line Package QFP :Quad Flat Package 四方扁平封装 TQFP :Thin Quad Flat Package 薄型四方扁平封装 PQFP :Plastic Quad Flat Package 塑料方型扁平封装 MQFP :Metric Quad Flat Package VQFP :Very Thin Quad Flat Package SOP :Small Outline Package 小外型封装 SSOP :Shrink Small-Outline Package 缩小外型封装 TSOP :Thin Small-Outline Package 薄型小尺寸封装 TSSOP :Thin Shrink Small-Outline Package QSOP :Quarter Small-Outline Package VSOP :Very Small Outline Package TVSOP :Very Thin Small-Outline Package LCC :Leadless Ceramic Chip Carrier 无引线芯片承载封装 LCCC :Leadless Ceramic Chip Carrier PLCC :Plastic Leaded Chip Carrier 塑料式引线芯片承载封装 BGA :Ball Grid Array 球栅阵列 CBGA :Ceramic Ball Grid Array Chip-Scale Ball-Grid Array uBGA :Micro Ball Grid Array 微型球栅阵列封装 PGA :Pin Grid Array CPGA :Ceramic Pin Grid Array 陶瓷 PGA PPGA :Plastic Pin Grid Array MCM :Multi Chip Model 多芯片模块 SMD(surface mount devices) —— 表面贴装器件。 SOIC(small out-line integrated circuit) —— 双侧引脚小外形封装集成电路 QFP(Quad Flat Pockage) —— 四侧引脚扁平封装 WLP: —— 晶片级封装
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