【产通社，10月18日】SEMI日前发布五项新的半导体制造技术标准。这些标准由来自设备与材料供应商、器件制造商以及其他参与SEMI国际标准项目厂商的技术专家们开发制定，可通过购买CD-ROM或在SEMI网站上下载获得。

SEMI标准每三年发布一次。这些新的专利作为2008年11月版的一部分，加入到过去35年中SEMI已发布的775个标准中。

“这些新的SEMI标准是基于产业专家们的合作与共识而制订的。”SEMI国际标准主管James Amano说道，“这些标准的执行将帮助厂商应对日益增加的制造挑战，改善收益率，并实现设备工艺的全球化兼容。”

五项标准分别是：
SEMI E139.3     XML/SOAP Binding for Recipe and Parameter Management(配方和参数管理的XML/SOAP结合)
SEMI G87     Specification for Plastic Tape Frame for 300 mm Wafer(300mm晶圆塑料带框规格)
SEMI M73     Test Methods for Extracting Relevant Characteristics from Measured Wafer Edge Profiles(由标准晶圆边缘提取相关特征的测试方法)
SEMI M74     Specification for 450 mm Diameter Mechanical Handling Polished Wafers(450mm抛光晶圆机械搬运规格)
SEMI T20     System Architecture for Preventing/Detecting Semiconductor Counterfeit Products(半导体仿冒品防止/探测系统架构)

SEMI Announces Five New Technical Standards

New Specifications Address Cycle Time Reduction, Counterfeit Prevention

SAN JOSE, Calif.  October 6, 2008 ? SEMI has published five new technical standards applicable to the semiconductor manufacturing industry. The new standards, developed by technical experts from equipment and materials suppliers, device manufacturers and other companies participating in the SEMI International Standards Program, are available for purchase in CD-ROM format or can be downloaded from the SEMI website, www.semi.org.
SEMI Standards are published three times a year. The new standards, part of the November 2008 publication cycle, join more than 775 standards that have been published by SEMI during the past 35 years.

“These new SEMI standards, which include specifications to address counterfeiting of products in the semiconductor manufacturing supply chain, are the result of collaborative, consensus-driven efforts among industry experts,” said James Amano, Director, SEMI International Standards. “Their implementation will help manage the ever increasing manufacturing challenges, improve yield and ensure compatibility of equipment and processes worldwide.”

The full list of SEMI standards being released include:

SEMI E139.3
XML/SOAP Binding for Recipe and Parameter Management

SEMI G87
Specification for Plastic Tape Frame for 300 mm Wafer

SEMI M73
Test Methods for Extracting Relevant Characteristics from Measured Wafer Edge Profiles

SEMI M74
Specification for 450 mm Diameter Mechanical Handling Polished Wafers

SEMI T20
System Architecture for Preventing/Detecting Semiconductor Counterfeit Products

The SEMI Standards Program, established in 1973, covers all aspects of semiconductor process equipment and materials, from wafer manufacturing to test, assembly and packaging, in addition to the manufacture of flat panel displays, photovoltaic systems and micro-electromechanical systems (MEMS).

About 1,650 volunteers worldwide participate in the program, which is made up of 18 global technical committees. Visit www.semi.org/standards for further details about SEMI Standards.

About SEMI:
SEMI is the global industry association serving the manufacturing supply chains for the microelectronic, display and photovoltaic industries. SEMI member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org