IPC-HDBK-001　Handbook and Guide to the Requirement for Soldered Electrical and Electronic Assemblies to Supplement ANSI/J-STD-001B 已焊接电子组装件的要求手册与导则
J-STD-001D　Requirements for Soldered Electrical & Electronic Assemblies 电气与电子组装件锡焊要求
J-STD-002B Solderability Tests for Component Leads,Terminations,Lugs,Terminals and Wires 元件引线、端子、焊片、接线柱及导线可焊性试验
J-STD-003A Solderability Test for Printed Boards 印制板可焊性试验
J-STD-004A Requirements for Soldering Fluxes锡焊焊剂要求
J-STD-005 Requirements for Soldering Pastes 焊膏技术要求
J-STD-006A Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for electronic Soldering Applications
J-STD-012 Implementation of flip chip and chip scale technology 倒装芯片及芯片级封装技术的应用
J-STD-013 Implementation of Ball Grid Array & Other High Density Technology 球栅阵列(BGA)及其它高密度封装技术的应用(1996-07)
J-STD-020C Moisture/Reflow Sensitivity classification for Non-Hermetic Solid State Surface Mount Devices 非密封固态表面贴装器件湿度/再流焊敏感度分类
J-STD-026 Semiconductor Design Standard for Flip Chip Applications 倒装芯片用印制板设计标准
J-STD-027 Mechanical Outline Standard for Flip Chip and Chip Size Configurations
J-STD-028 Performance Standard for Construction of Flip Chip and Chip Scale Bumps 倒装芯片及芯片凸块结构的性能标准
J-STD-032 Performance Standard for Ball Grid Array Balls 球珊阵列性能标准
J-STD-033A Standard for Handling Packing Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices 对湿度、再流焊敏感表贴装器件的处置、包装、发运和使用
J-STD-035 Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components 非气密封装电子元件用声波显微镜(1999-04)

更多PCB标准信息，请访问http://www.cpca.org.cn/partition/partition_7/partition_7.asp。