【产通社，10月18日讯】史恩希半导体（SMSC；NASDAQ: SMSC）官网消息，其已经将片内连接（Inter-Chip Connectivity，ICC）专利技术授权给三星电子公司（Samsung Electronics Co., Ltd）。

ICC专利技术已成为数十亿台电子设备的标准USB 2.0协议，能仅以传统USB 2.0模拟接口一小部分的功率进行短距离传输，但同时仍保持模拟USB 2.0连接的大部分软件兼容性。高速互连（HSIC）规范（此为USB 2.0规范的补充）已将ICC技术纳入其中。在适用情况下，例如便携式应用等，相较于模拟USB 2.0接口，ICC技术能减少功耗与芯片面积。

通过从SMSC取得的ICC技术授权，三星能同时针对USB 2.0主机（host）和USB 2.0设备（device）的应用，开发出符合HSIC规范的器件。查询进一步信息，请访问http://www.smsc.com/index.php?tid=74。

About SMSC's ICC Technology

SMSC's ICC technology is described in U.S. Patent No. 7,702,832, which was issued to SMSC on April 20, 2010. Additional related patent applications have been filed by SMSC in the United States and other countries. As provided for in the appropriate agreements, USB 2.0 promoters and companies that have timely signed both the USB 2.0 Adopters Agreement and a related HSIC amendment letter may license SMSC's ICC technology patents under reasonable and non-discriminatory (RAND) terms. Further, SMSC's ICC technology is now available to the industry at large through individually negotiated patent licenses from SMSC. For information about licensing SMSC's patented ICC technology, please visit http://www.smsc.com/icc.