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ÏȽøµÄ¶¯Á¦×ܳɿØÖÆ£¨Powertrain Control£©-Freescale
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·É˼¿¨¶ûÔÚÆû³µµç×ÓÐÐÒµ¾ßÓÐÉîºñµÄ¼¼Êõ»ù´¡£¬²¢»ý¼«²ÎÓëÐÐҵЭ»áµÄ¸÷Öֻ¡£·É˼¿¨¶ûÊÇDSI¡¢FlexRayºÍLINЭ»áµÄ´´Ê¼³ÉÔ±£¬AUTOSARЭ»áµÄÖ÷Òª³ÉÔ±£¬ÒÔ¼°PSI5¡¢JASPARºÍGENIVIЭ»áµÄ»îÔ¾³ÉÔ±¡£

ÈçÐèÁ˽â¶Ô¸ß¼¶¿ØÖƼܹ¹µÄÐèÇó¡¢ÒÔ¼°·É˼¿¨¶û¿ÉÂú×ãÄ¿Ç°ºÍδÀ´¶¯Á¦×ܳÉÐèÇóµÄ¶àºË½â¾ö·½°¸µÄÏêϸÐÅÏ¢£¬ÇëÔĶÁ¡¶Challenges and Solutions in Advanced Powertrain Controls¡·°×ƤÊ飬¾ßÌåÍøַΪhttp://www.freescale.com/webapp/sps/site/prod_summary.jsp?code=MPC5676R&fpsp=1&tab=Documentation_Tab¡£

White Paper
Challenges and Solutions in Advanced Powertrain Controls
Freescale Semiconductor


Each new generation of powertrain controls challenges systems designers with higher complexity and the need for increased computing performance. Driven by global regulations, performance requirements include increased throughput, memory, peripheral and advanced packaging capabilities. Increasingly tougher emission regulations, as well as unprecedented fuel efficiency targets, require sophisticated systems that extend well beyond traditional spark ignition (SI) engine and transmission control. The addition of hybrid electric vehicles and plug-in hybrid electric vehicles with motors, battery and system management electronics dictate control technologies that depart from traditional improvement trends.

As a leading supplier of automotive powertrain microcontrollers (MCUs), Freescale Semiconductor has addressed these challenges as it has facilitated automotive industry¡¯s pioneering efforts in electronics control. This white paper will provide background on the need for an advanced control architecture and a multicore solution that addresses current and future powertrain needs.

Global Regulations Impact Powertrain

According to the International Energy Agency  (IEA) report ¡°Transport Energy Efficiency,¡± transportation represents 23 percent of global CO2 emissions. Based on global concerns, governments in all regions have taken steps to reduce CO2 and other emissions and increase vehicle fuel economy. (Reduced fuel consumption directly results in lower CO2 emissions.)

In the U.S., recent legislation calls for carmakers to meet a corporate average fuel economy (CAFE) target of 54.5 miles per gallon by 2025. The reduction from today¡¯s passenger vehicles that average 27.8 mpg requires an average increase in fuel economy of five percent for cars and three and a half percent for light trucks per year through 2021, with a five percent increase for all vehicles after that. Already well ahead of the U.S. in lower fuel consumption, the European Union (EU) plans to achieve a fleet-wide average of 65 mpg by 2020.

Figure 1 shows a phase-in of EU regulations to limit emissions to 120 g/km of CO2 per car for 65 percent of new cars by 2012 and an increase in the requirements to 100 percent by 2015. Non-compliance can result in EU fines up to 95 for every gram of CO2 above the target for each vehicle sold. Internal combustion engine improvements as well as electrification are required to meet the standards.

Europe is leading the way with regulations in this area but other regions, including the U.S. and Japan, have their own challenging requirements. In the U.S., changes to satisfy the 2016 goals (noted in Figure 1) will require the greatest improvements. Even if this level is achieved by 2016, the values will just match where Europe was five years ago. This opportunity for improvement requires higher performance in powertrain control.

While some of the improvements to reduce CO2 can be achieved by reducing weight, rolling resistance and improving aerodynamic properties, powertrain has been identified as the system that can provide the greatest improvement with a 10 percent engine fuel consumption reduction and from 10 to 15g of CO2 reduction. In this case, an increase in spending for additional MCU performance, such as an increase in DMIPS from 200 (the high-end capability on production vehicles) to 600 or 800 can avoid the €95 surcharge per car. As a result, performance has a direct impact on cost or penalty avoidance.

To meet these global government requirements, carmakers must significantly update their existing software and hardware but are challenged by limitations that include memory and throughput to run new algorithms as well as the cost impact of any new control. The solution to these restrictions is a dual-core MCU built using the industry¡¯s most popular powertrain architecture.

As shown in Table 1, the dual-core Qorivva MPC5676R MCU, built on Power Architecture® technology, provides substantial improvements in numerous areas that specifically impact powertrain controls. Designed to provide the improvements that system designers have requested, the increased complexity of next-generation control systems now has a straightforward path from today¡¯s systems with several exciting possibilities.

The MPC5676R is the first dual-core Power Architecture device for powertrain applications, and provides virtually seamless compatibility with its single-core predecessor, the MPC5674F. At the same time, it introduces a powerful set of new dual-core features to combat the challenge of novel, computation intensive software such as that used for virtual sensing and heuristic control algorithms.

These capabilities enable developers to eliminate the need for many external components, which can help reduce system cost by nearly 30 percent over conventional systems and make advanced fuel-saving technology more affordable.

Increased capability can be put into perspective through examples and concepts or possibilities of what can be accomplished with the new dual-core MCU that were difficult or impossible before.

Powertrain Control in Internal Combustion Engines

................


How to Reach Us:
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Automotive Information:
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e-mail:support@freescale.com

USA/Europe or Locations Not Listed:
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Europe, Middle East, and Africa:
Freescale Halbleiter Deutschland GmbH
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+44 1296 380 456 (English)
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Japan:
Freescale Semiconductor Japan Ltd.
Headquarters
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Tokyo 153-0064, Japan
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+81 3 5437 9125
support.japan@freescale.com

Asia/Pacific:
Freescale Semiconductor Hong Kong Ltd.
Technical Information Center
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Tai Po Industrial Estate,
Tai Po, N.T., Hong Kong
+800 2666 8080
support.asia@freescale.com

For Literature Requests Only:
Freescale Semiconductor
Literature Distribution Center
P.O. Box 5405
Denver, Colorado 80217
1-800-441-2447
303-675-2140
Fax: 303-675 2150
LDCForFreescaleSemiconductor@hibbertgroup.com

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